電子灌封膠研究進(jìn)展

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關(guān)鍵詞：電子灌封膠；環(huán)氧樹脂灌封膠；聚氨酯灌封膠；有機(jī)硅灌封膠；綜合性能

中圖分類號(hào)：TQ433.4'37  文獻(xiàn)標(biāo)志碼：A 文章編號(hào)：1001-59（05）05-0017-04

Abstract：With thedevelopment of power electronic components to high-power miniaturization，electronic devices putforward higher performance requirements for electronic poting compounds.Epoxy resin potting compound，polyurethane poting compound and silicone poting compound have good thermal conductivity，excelent insulation，low thermal expansion coeffcient，low viscosity，strong flame retardant ability，andhave reliablecomprehensive properties such as strength，hardness，toughness，temperatureand weather resistance，etc.，which have atracted the attentionof he electronics industryand have been widely used in the fieldof electronic components.The development of high-performance electronic potting adhesives with“excelent thermal conductivity，high strength，good toughness and strong comprehensive performance”has become the focus and hot spot of current research.This paper reviews theresearch progress of electronic poting compounds，introduces the types of electronic poting compounds，andelaborates the performance control methods and applications of electronic potting compounds，and puts forward insights on the future research and development direction of electronic potting compounds.

Key words： electronic encapsulants ； epoxy resin encapsulants； polyurethane encapsulants； silicone encapsulants； overall properties

高功率、小型化是當(dāng)今電力電子元件的發(fā)展趨勢(shì)，這就對(duì)配套使用的電子灌封膠提出了更加苛刻的要求[1]。（剩余6924字）