溫度作用下高精電子廠房開(kāi)洞華夫板的力學(xué)性能分析

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Abstract：In order to analyze the stress and crack response of the floor under temperature influence in perforated waffle plate without expansion joints，the ABAQUS finite element analysis software is used to simulate the perforated wafle plate，comparing with the engineering practice，the stress and deformation of this kind of floor under different sizes and temperature variations are obtained. The results show that under the daily temperature variation，thefloor in the core area does not exceed the calculation stress limit，and the maximum displacement and stress concentration mainly appear at the slab-column joints.With the increase of concrete strength，the overall stress has no obvious change under the same temperature difference，and the increment is less than 2% ，but the increase of floor thickness leads to the sudden change of stress and the change of deformation trend. Considering the block construction of the reinforced concrete floor with large span，the reasonable control of the temperature difference between plates within 15-30°C is beneficial to the uniform stress distribution in the floor after monolithic pouring.

Keywords：temperature efect; perforated waffle plate； finite element simulation; super-long concrete

光電產(chǎn)業(yè)已成為新一代信息技術(shù)的重要支撐，對(duì)推動(dòng)數(shù)字經(jīng)濟(jì)、智能制造等戰(zhàn)略性新興產(chǎn)業(yè)的發(fā)展起到關(guān)鍵性作用。（剩余11079字）